IC Package Engineer
About The Position
For an exciting well-funded start-up we are seeking a skilled ASIC Package Engineer to join our dynamic team. The ideal candidate will have expertise in designing, developing, and testing advanced packaging solutions for Application-Specific Integrated Circuits (ASICs). As an ASIC Package Engineer, you will collaborate closely with cross-functional teams including ASIC designers, system architects, and manufacturing engineers to deliver high-performance and cost-effective packaging solutions.
Requirements
Responsibilities:
- Design and develop innovative packaging solutions for ASICs, considering factors such as electrical performance, thermal management, and reliability.
- Conduct feasibility studies and analysis to assess packaging options and advanced packaging technologies.
- Collaborate with ASIC designers to optimize package designs for signal integrity, power integrity.
- Work closely with manufacturing partners to ensure seamless integration of packaging processes into production workflows.
- Perform package simulations, modelling, and characterization to validate design performance and reliability under various operating conditions.
- Drive continuous improvement initiatives to enhance packaging design methodologies, tools, and best practices.
- Provide technical support to resolve packaging-related issues during product development and production ramp-up phases.
- Stay abreast of emerging packaging technologies, industry trends, and market developments to maintain competitive advantage.
Qualifications:
- Bachelor's or master’s degree in electrical engineering, Mechanical Engineering, or related field.
- Proven experience in ASIC packaging design and development in semiconductor industry.
- Proficiency in CAD tools such as Ansys and Cadence toolset, or equivalent for package design and layout.
- Strong understanding of semiconductor packaging technologies, materials, and assembly processes.
- Familiarity with industry standards and specifications for ASIC packaging, including JEDEC, IPC, and SEMI.
- Excellent analytical and problem-solving skills with a keen attention to detail.
- Effective communication and collaboration skills to work in a fast-paced, cross-functional environment.
- Ability to manage multiple projects simultaneously and deliver results within tight deadlines.
- Experience with advanced packaging techniques such as 2.5D/3D integration, Flip Chip BGA (FCBGA), system-in-package (SiP), and fan-out wafer-level packaging (FOWLP).
- Knowledge of thermal management techniques and thermal simulation tools for package design optimization.
- Familiarity with reliability testing methodologies and standards for semiconductor devices.
Preferred Qualifications:
- Hands-on experience with lab equipment for package characterization and failure analysis.
- Advanced degree (Ph.D.) in Electrical Engineering, Mechanical Engineering, or related field.
