IC Package Engineer

Austin, Texas · Full-time

About The Position

For an exciting well-funded start-up we are seeking a skilled ASIC Package Engineer to join our dynamic team. The ideal candidate will have expertise in designing, developing, and testing advanced packaging solutions for Application-Specific Integrated Circuits (ASICs). As an ASIC Package Engineer, you will collaborate closely with cross-functional teams including ASIC designers, system architects, and manufacturing engineers to deliver high-performance and cost-effective packaging solutions.


Requirements

Responsibilities:

  1. Design and develop innovative packaging solutions for ASICs, considering factors such as electrical performance, thermal management, and reliability.
  2. Conduct feasibility studies and analysis to assess packaging options and advanced packaging technologies.
  3. Collaborate with ASIC designers to optimize package designs for signal integrity, power integrity.
  4. Work closely with manufacturing partners to ensure seamless integration of packaging processes into production workflows.
  5. Perform package simulations, modelling, and characterization to validate design performance and reliability under various operating conditions.
  6. Drive continuous improvement initiatives to enhance packaging design methodologies, tools, and best practices.
  7. Provide technical support to resolve packaging-related issues during product development and production ramp-up phases.
  8. Stay abreast of emerging packaging technologies, industry trends, and market developments to maintain competitive advantage.

 

Qualifications:

  1. Bachelor's or master’s degree in electrical engineering, Mechanical Engineering, or related field.
  2. Proven experience in ASIC packaging design and development in semiconductor industry.
  3. Proficiency in CAD tools such as Ansys and Cadence toolset, or equivalent for package design and layout.
  4. Strong understanding of semiconductor packaging technologies, materials, and assembly processes.
  5. Familiarity with industry standards and specifications for ASIC packaging, including JEDEC, IPC, and SEMI.
  6. Excellent analytical and problem-solving skills with a keen attention to detail.
  7. Effective communication and collaboration skills to work in a fast-paced, cross-functional environment.
  8. Ability to manage multiple projects simultaneously and deliver results within tight deadlines.
  9. Experience with advanced packaging techniques such as 2.5D/3D integration, Flip Chip BGA (FCBGA), system-in-package (SiP), and fan-out wafer-level packaging (FOWLP).
  10. Knowledge of thermal management techniques and thermal simulation tools for package design optimization.
  11. Familiarity with reliability testing methodologies and standards for semiconductor devices.

Preferred Qualifications:

  1. Hands-on experience with lab equipment for package characterization and failure analysis.
  2. Advanced degree (Ph.D.) in Electrical Engineering, Mechanical Engineering, or related field.

 

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